Inventor
GONZALEZ CARLOS A
US12 patents
Patents
12 patentsUS6750551B1Jun 15, 2004
Direct BGA attachment without solder reflow
INTEL CORP120 citations97
US6657131B2Dec 2, 2003
I/C package / thermal-solution retention mechanism with spring effect
INTEL CORP45 citations94
US7122403B2Oct 17, 2006
Method of interconnecting die and substrate
INTEL CORP26 citations92
US7096580B2Aug 29, 2006
I/C package/thermal-solution retention mechanism with spring effect
INTEL CORP20 citations91
US7323360B2Jan 29, 2008
Electronic assemblies with filled no-flow underfill
INTEL CORP32 citations90
US6750549B1Jun 15, 2004
Variable pad diameter on the land side for improving the co-planarity of ball grid array packages
INTEL CORP43 citations88
US7235886B1Jun 26, 2007
Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby
INTEL CORP16 citations83
US6672892B2Jan 6, 2004
Package retention module coupled directly to a socket
INTEL CORP13 citations83
US6600652B2Jul 29, 2003
Package retention module coupled directly to a socket
INTEL CORP16 citations83
US7498678B2Mar 3, 2009
Electronic assemblies and systems with filled no-flow underfill
INTEL CORP9 citations82
US6752634B2Jun 22, 2004
Contact array for semiconductor package
INTEL CORP9 citations73
US6884943B1Apr 26, 2005
I/C package/ thermal-solution retention mechanism with spring effect
INTEL CORP11 citations72