Inventor
ALCOE DAVID JAMES
US12 patents
Patents
12 patentsUS5877043AMar 2, 1999
Electronic package with strain relief means and method of making
IBM243 citations97
US5760465AJun 2, 1998
Electronic package with strain relief means
IBM97 citations96
US6654250B1Nov 25, 2003
Low-stress compressive heatsink structure
IBM73 citations95
US5863814AJan 26, 1999
Electronic package with compressible heatsink structure
IBM37 citations95
US5786635AJul 28, 1998
Electronic package with compressible heatsink structure
IBM54 citations95
US6740959B2May 25, 2004
EMI shielding for semiconductor chip carriers
IBM97 citations94
US6255136B1Jul 3, 2001
Method of making electronic package with compressible heatsink structure
IBM20 citations92
US6245186B1Jun 12, 2001
Electronic package with compressible heatsink structure
IBM33 citations92
US6051982AApr 18, 2000
Electronic component test apparatus with rotational probe and conductive spaced apart means
IBM52 citations92
US5947750ASep 7, 1999
Elastomeric structure with multi-layered elastomer and constraining base
IBM50 citations92
US5804984ASep 8, 1998
Electronic component test apparatus with rotational probe
IBM30 citations92
US6060341AMay 9, 2000
Method of making an electronic package
IBM5 citations58