Inventor
IGGULDEN ROY C
US14 patents
⚠️ This page may combine multiple inventors who share the name “IGGULDEN ROY C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
10 patentsUS6383920B1May 7, 2002
Process of enclosing via for improved reliability in dual damascene interconnects
IBM179 citations98
US7560375B2Jul 14, 2009
Gas dielectric structure forming methods
IBM34 citations92
US6057236AMay 2, 2000
CVD/PVD method of filling structures using discontinuous CVD AL liner
IBM17 citations83
US6887785B1May 3, 2005
Etching openings of different depths using a single mask layer method and structure
IBM17 citations82
US7287325B2Oct 30, 2007
Method of forming interconnect structure or interconnect and via structures using post chemical mechanical polishing
IBM3 citations63
US6361880B1Mar 26, 2002
CVD/PVD/CVD/PVD fill process
IBM6 citations61
US7361584B2Apr 22, 2008
Detection of residual liner materials after polishing in damascene process
IBM0 citations51
US6413866B1Jul 2, 2002
Method of forming a solute-enriched layer in a substrate surface and article formed thereby
IBM0 citations51
US6960306B2Nov 1, 2005
Low Cu percentages for reducing shorts in AlCu lines
IBM0 citations44
US7473636B2Jan 6, 2009
Method to improve time dependent dielectric breakdown
IBM0 citations42
INFINEON TECHNOLOGIES AG
3 patentsUS6734097B2May 11, 2004
Liner with poor step coverage to improve contact resistance in W contacts
INFINEON TECHNOLOGIES AG27 citations90
US6870263B1Mar 22, 2005
Device interconnection
INFINEON TECHNOLOGIES AG15 citations82
US6635564B1Oct 21, 2003
Semiconductor structure and method of fabrication including forming aluminum columns
INFINEON TECHNOLOGIES AG2 citations62