Inventor · disambiguated record
Casey J. Feinstein
Also filed as: FEINSTEIN CASEY · FEINSTEIN CASEY J
18 granted patents·1 pending application·198 citations·filing 2004–2014
93Inventor score
Top patents by PatentIndex Score
19 records- 0198US7810355B2Full perimeter chemical strengthening of substratesAPPLE INC·Filed 2008·Granted Oct 12, 2010·72 cites·15 claims
- 0296US8673163B2Method for fabricating thin sheets of glassZHONG JOHN Z·Filed 2008·Granted Mar 18, 2014·52 cites·9 claims
- 0392US8196636B23-dimensional curved substrate laminationSUNG KUO-HUA·Filed 2010·Granted Jun 12, 2012·10 cites·17 claims
- 0489US8857490B23-dimensional curved substrate laminationSUNG KUO-HUA·Filed 2012·Granted Oct 14, 2014·10 cites·19 claims
- 0588US8808483B2Method of making a curved touch panelSUNG KUO-HUA·Filed 2010·Granted Aug 19, 2014·13 cites·12 claims
- 0683US9409383B2Layer-specific energy distribution delaminationFEINSTEIN CASEY J·Filed 2009·Granted Aug 9, 2016·6 cites·29 claims
- 0782US8608896B2Liquid adhesive lamination for precision adhesive controlHORSTKEMPER RALF·Filed 2011·Granted Dec 17, 2013·8 cites·19 claims
- 0879US8944659B2Methods for assembling electronic devices using embedded light guide structuresDABOV TEODOR·Filed 2012·Granted Feb 3, 2015·4 cites·18 claims
- 0979US8123894B23-dimensional curved substrate laminationSUNG KUO·Filed 2008·Granted Feb 28, 2012·4 cites·17 claims
- 1074US9046684B1Method for selectively treating surfacesFEINSTEIN CASEY·Filed 2012·Granted Jun 2, 2015·3 cites·13 claims
- 1173US7345806B2Method and apparatus for characterizing microelectromechanical devices on wafersTEXAS INSTRUMENTS INC·Filed 2004·Granted Mar 18, 2008·11 cites·32 claims
- 1271US8946561B2Flexible circuitry with heat and pressure spreading layersWURZEL JOSHUA G·Filed 2012·Granted Feb 3, 2015·2 cites·20 claims
- 1368US8875652B2Liquid adhesive boundary controlFEINSTEIN CASEY J·Filed 2011·Granted Nov 4, 2014·3 cites·14 claims
- 1461US2011151202A1Controllable Placement of Liquid Adhesive on SubstrateFEINSTEIN CASEY J·Filed 2009·Application pending·0 cites
- 1560US9615448B2Method for fabricating thin sheets of glassAPPLE INC·Filed 2014·Granted Apr 4, 2017·0 cites·20 claims
- 1647US9405388B2Full perimeter chemical strengthening of substratesFEINSTEIN CASEY J·Filed 2010·Granted Aug 2, 2016·0 cites·18 claims
- 1743US9944554B2Perforated mother sheet for partial edge chemical strengthening and method thereforHONG SEUNG JAE·Filed 2011·Granted Apr 17, 2018·0 cites·22 claims
- 1841US9213451B2Thin glass for touch panel sensors and methods thereforGRESPAN SILVIO·Filed 2010·Granted Dec 15, 2015·0 cites·24 claims
- 1940US9063605B2Thin glass processing using a carrierFEINSTEIN CASEY J·Filed 2011·Granted Jun 23, 2015·0 cites·21 claims
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