Inventor

MURPHY STEPHEN A

US4 patents

⚠️ This page may combine multiple inventors who share the name “MURPHY STEPHEN A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LSI LOGIC CORP

1 patent

US5998242ADec 7, 1999

Vacuum assisted underfill process and apparatus for semiconductor package fabrication

LSI LOGIC CORP90 citations94

STATS CHIPPAC LTD

1 patent

US9711438B2Jul 18, 2017

Semiconductor device and method of forming a dual UBM structure for lead free bump connections

STATS CHIPPAC LTD5 citations81

LIN LI-JEN

1 patent

US8759209B2Jun 24, 2014

Semiconductor device and method of forming a dual UBM structure for lead free bump connections

LIN LI-JEN6 citations76

DO BYUNG TAI

1 patent

US8309451B2Nov 13, 2012

Semiconductor device and method of providing common voltage bus and wire bondable redistribution

DO BYUNG TAI5 citations62