Inventor
FAZELPOUR SIAMAK
US21 patents
⚠️ This page may combine multiple inventors who share the name “FAZELPOUR SIAMAK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SKYWORKS SOLUTIONS INC
8 patentsUS6608363B1Aug 19, 2003
Transformer comprising stacked inductors
SKYWORKS SOLUTIONS INC33 citations92
US6512285B1Jan 28, 2003
High inductance inductor in a semiconductor package
SKYWORKS SOLUTIONS INC35 citations92
US6674174B2Jan 6, 2004
Controlled impedance transmission lines in a redistribution layer
SKYWORKS SOLUTIONS INC37 citations91
US6611048B1Aug 26, 2003
Exposed paddle leadframe for semiconductor die packaging
SKYWORKS SOLUTIONS INC22 citations90
US6781229B1Aug 24, 2004
Method for integrating passives on-die utilizing under bump metal and related structure
SKYWORKS SOLUTIONS INC17 citations84
US6576983B1Jun 10, 2003
Controlled impedance leads in a leadframe for high frequency applications
SKYWORKS SOLUTIONS INC16 citations84
US6674646B1Jan 6, 2004
Voltage regulation for semiconductor dies and related structure
SKYWORKS SOLUTIONS INC15 citations82
US6501158B1Dec 31, 2002
Structure and method for securing a molding compound to a leadframe paddle
SKYWORKS SOLUTIONS INC10 citations71
APPLIED MICRO CIRCUITS CORP
5 patentsUS6617943B1Sep 9, 2003
Package substrate interconnect layout for providing bandpass/lowpass filtering
APPLIED MICRO CIRCUITS CORP38 citations92
US6566761B1May 20, 2003
Electronic device package with high speed signal interconnect between die pad and external substrate pad
APPLIED MICRO CIRCUITS CORP22 citations92
US6812576B1Nov 2, 2004
Fanned out interconnect via structure for electronic package substrates
APPLIED MICRO CIRCUITS CORP15 citations84
US6713853B1Mar 30, 2004
Electronic package with offset reference plane cutout
APPLIED MICRO CIRCUITS CORP11 citations73
US6762494B1Jul 13, 2004
Electronic package substrate with an upper dielectric layer covering high speed signal traces
APPLIED MICRO CIRCUITS CORP6 citations60
QUALCOMM INC
4 patentsUS9536805B2Jan 3, 2017
Power management integrated circuit (PMIC) integration into a processor package
QUALCOMM INC12 citations82
US10008316B2Jun 26, 2018
Inductor embedded in a package substrate
QUALCOMM INC4 citations72
US9214426B1Dec 15, 2015
Highly coupled spiral planar inductors structure at bump to compensate on die excess capacitance of differential I/O
QUALCOMM INC2 citations54
US9514966B2Dec 6, 2016
Apparatus and methods for shielding differential signal pin pairs
QUALCOMM INC1 citations51
CONEXANT SYSTEMS INC
3 patentsUS6534854B1Mar 18, 2003
Pin grid array package with controlled impedance pins
CONEXANT SYSTEMS INC36 citations92
US6424541B1Jul 23, 2002
Electronic device attachment methods and apparatus for forming an assembly
CONEXANT SYSTEMS INC11 citations73
US6274925B1Aug 14, 2001
Low inductance top metal layer design
CONEXANT SYSTEMS INC13 citations73