Inventor

HSIEH MING-FUNG

TW2 patents

Patents

2 patents

US8633793B1Jan 21, 2014

Common mode filter

INPAQ TECHNOLOGY CO LTD7 citations79

US8933343B2Jan 13, 2015

Electronic structure and electronic package component for increasing the bonding strength between inside and outside electrodes

INPAQ TECHNOLOGY CO LTD0 citations35