P

Inventor

HONG JISUN

KR4 patents
⚠️ This page may combine multiple inventors who share the name “HONG JISUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

3 patents
US10032706B2Jul 24, 2018

Package substrates

SAMSUNG ELECTRONICS CO LTD2 citations70
US9112062B2Aug 18, 2015

Semiconductor device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations50
US10256181B2Apr 9, 2019

Package substrates

SAMSUNG ELECTRONICS CO LTD0 citations49

HONG JISUN

1 patent
US8558371B2Oct 15, 2013

Method for wafer level package and semiconductor device fabricated using the same

HONG JISUN5 citations66