Inventor
SHAN WEI-HENG
TW7 patents
Patents
7 patentsUS6713856B2Mar 30, 2004
Stacked chip package with enhanced thermal conductivity
ULTRATERA CORP98 citations96
US6849932B2Feb 1, 2005
Double-sided thermally enhanced IC chip package
ULTRATERA CORP31 citations91
US6683385B2Jan 27, 2004
Low profile stack semiconductor package
ULTRATERA CORP39 citations91
US6555919B1Apr 29, 2003
Low profile stack semiconductor package
ULTRATERA CORP20 citations83
US6911604B2Jun 28, 2005
Bonding pads of printed circuit board capable of holding solder balls securely
ULTRATERA CORP10 citations72
US6857865B2Feb 22, 2005
Mold structure for package fabrication
ULTRATERA CORP10 citations72
US6709894B2Mar 23, 2004
Semiconductor package and method for fabricating the same
ULTRATERA CORP10 citations72