Inventor
CHO YOUNGSANG
KR14 patents
⚠️ This page may combine multiple inventors who share the name “CHO YOUNGSANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
10 patentsUS10937771B2Mar 2, 2021
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD3 citations71
US10347611B2Jul 9, 2019
Semiconductor packages having redistribution substrate
SAMSUNG ELECTRONICS CO LTD4 citations71
US11502061B2Nov 15, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations70
US12451400B2Oct 21, 2025
Semiconductor package having improved heat dissipation characteristics
SAMSUNG ELECTRONICS CO LTD0 citations62
US12394687B2Aug 19, 2025
Semiconductor package including a heat dissipation structure
SAMSUNG ELECTRONICS CO LTD0 citations61
US11251102B2Feb 15, 2022
Semiconductor module including heat dissipation layer
SAMSUNG ELECTRONICS CO LTD0 citations61
US11837581B2Dec 5, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11854648B2Dec 26, 2023
Method of resetting storage device, storage device performing the same and data center including the same
SAMSUNG ELECTRONICS CO LTD1 citations58
US11488640B2Nov 1, 2022
Method of resetting storage device, storage device performing the same and data center including the same
SAMSUNG ELECTRONICS CO LTD1 citations58
US11495578B2Nov 8, 2022
Semiconductor package and PoP type package
SAMSUNG ELECTRONICS CO LTD0 citations50