Inventor
MIYAZAWA IKUYA
JP12 patents
Patents
12 patentsUS7214615B2May 8, 2007
Method of manufacturing semiconductor device, semiconductor device, circuit substrate and electronic apparatus
SEIKO EPSON CORP113 citations96
US7029937B2Apr 18, 2006
Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
SEIKO EPSON CORP84 citations96
US6873054B2Mar 29, 2005
Semiconductor device and a method of manufacturing the same, a circuit board and an electronic apparatus
SEIKO EPSON CORP234 citations96
US6841849B2Jan 11, 2005
Semiconductor device and method of manufacturing the same, circuit board and electronic instrument
SEIKO EPSON CORP66 citations94
US6732907B2May 11, 2004
Soldering method, soldering device, and method and device of fabricating electronic circuit module
SEIKO EPSON CORP3 citations61
US6730173B2May 4, 2004
Method and apparatus of manufacturing electronic circuit module, and method and apparatus of manufacturing semiconductor module
SEIKO EPSON CORP3 citations61
US10850519B2Dec 1, 2020
Liquid ejecting head and liquid ejecting apparatus
SEIKO EPSON CORP0 citations51
US9822452B2Nov 21, 2017
Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatus
SEIKO EPSON CORP0 citations51
US8960865B2Feb 24, 2015
Liquid droplet ejecting head and printing apparatus
SEIKO EPSON CORP0 citations51
US10603914B2Mar 31, 2020
MEMS device, liquid ejecting head, and liquid ejecting apparatus
SEIKO EPSON CORP0 citations41
US9708715B2Jul 18, 2017
Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatus
SEIKO EPSON CORP0 citations41
US8960861B2Feb 24, 2015
Liquid droplet ejecting head, printing apparatus and method of manufacturing liquid droplet ejecting head
SEIKO EPSON CORP0 citations41