Inventor
YANG CHING-LI
TW18 patents
⚠️ This page may combine multiple inventors who share the name “YANG CHING-LI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
14 patentsUS8916471B1Dec 23, 2014
Method for forming semiconductor structure having through silicon via for signal and shielding structure
UNITED MICROELECTRONICS CORP35 citations92
US7387950B1Jun 17, 2008
Method for forming a metal structure
UNITED MICROELECTRONICS CORP31 citations92
US9773860B1Sep 26, 2017
Capacitor and method for fabricating the same
UNITED MICROELECTRONICS CORP4 citations72
US8841755B2Sep 23, 2014
Through silicon via and method of forming the same
UNITED MICROELECTRONICS CORP5 citations71
US11916018B2Feb 27, 2024
Manufacturing method of connection structure of semiconductor device
UNITED MICROELECTRONICS CORP0 citations62
US11664333B2May 30, 2023
Method of manufacturing die seal ring
UNITED MICROELECTRONICS CORP0 citations62
US10978391B2Apr 13, 2021
Connection structure of semiconductor device and manufacturing method thereof
UNITED MICROELECTRONICS CORP1 citations62
US10892235B2Jan 12, 2021
Die seal ring and manufacturing method thereof
UNITED MICROELECTRONICS CORP1 citations62
US8884398B2Nov 11, 2014
Anti-fuse structure and programming method thereof
UNITED MICROELECTRONICS CORP2 citations62
US7649268B2Jan 19, 2010
Semiconductor wafer
UNITED MICROELECTRONICS CORP4 citations62
US12315827B2May 27, 2025
Semiconductor structure including seal ring structure
UNITED MICROELECTRONICS CORP0 citations61
US9312208B2Apr 12, 2016
Through silicon via structure
UNITED MICROELECTRONICS CORP1 citations51
US9048246B2Jun 2, 2015
Die seal ring and method of forming the same
UNITED MICROELECTRONICS CORP1 citations51
US7696606B2Apr 13, 2010
Metal structure
UNITED MICROELECTRONICS CORP0 citations51