Inventor
SHINDE SUBHASH L
US43 patents
⚠️ This page may combine multiple inventors who share the name “SHINDE SUBHASH L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
33 patentsUS6262390B1Jul 17, 2001
Repair process for aluminum nitride substrates
IBM66 citations96
US5981310ANov 9, 1999
Multi-chip heat-sink cap assembly
IBM59 citations95
US6292367B1Sep 18, 2001
Thermally efficient semiconductor chip
IBM47 citations93
US6373133B1Apr 16, 2002
Multi-chip module and heat-sink cap combination
IBM34 citations92
US6291272B1Sep 18, 2001
Structure and process for making substrate packages for high frequency application
IBM33 citations92
US5296189AMar 22, 1994
Method for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewith
IBM39 citations92
US5292477AMar 8, 1994
Supersaturation method for producing metal powder with a uniform distribution of dispersants method of uses thereof and structures fabricated therewith
IBM20 citations92
US5628849AMay 13, 1997
Method for in-situ environment sensitive sealing and/or product controlling
IBM31 citations90
US7544527B2Jun 9, 2009
Method and apparatus for providing optoelectronic communication with an electronic device
IBM12 citations84
US7245022B2Jul 17, 2007
Semiconductor module with improved interposer structure and method for forming the same
IBM17 citations84
US7084496B2Aug 1, 2006
Method and apparatus for providing optoelectronic communication with an electronic device
IBM14 citations84
US5218296AJun 8, 1993
Method and apparatus for determining at least one characteristic of a superconductive film
IBM19 citations82
US6995084B2Feb 7, 2006
Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
IBM7 citations74
US6793407B2Sep 21, 2004
Manufacturable optical connection assemblies
IBM9 citations74
US6352014B1Mar 5, 2002
Method for making punches using multi-layer ceramic technology
IBM12 citations74
US5482903AJan 9, 1996
Aluminum nitride body utilizing a vitreous sintering additive
IBM11 citations73
US5304517AApr 19, 1994
Toughened glass ceramic substrates for semiconductor devices subjected to oxidizing atmospheres during sintering
IBM11 citations73
US6096565AAug 1, 2000
Multi-layer glass ceramic module with superconductor wiring
IBM14 citations72
US6002951ADec 14, 1999
Multi-layer ceramic substrate having high TC superconductor circuitry
IBM5 citations72
US5552107ASep 3, 1996
Aluminum nitride body having graded metallurgy
IBM9 citations72
US5552232ASep 3, 1996
Aluminum nitride body having graded metallurgy
IBM4 citations72
US6413339B1Jul 2, 2002
Low temperature sintering of ferrite materials
IBM7 citations71
US6004624ADec 21, 1999
Method for the controlling of certain second phases in aluminum nitride
IBM5 citations71
US6652956B2Nov 25, 2003
X-ray printing personalization technique
IBM2 citations63
US7473997B2Jan 6, 2009
Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
IBM4 citations62
US7128472B2Oct 31, 2006
Method and apparatus for providing optoelectronic communication with an electronic device
IBM3 citations62
US6827505B2Dec 7, 2004
Optoelectronic package structure and process for planar passive optical and optoelectronic devices
IBM4 citations60
US6200373B1Mar 13, 2001
Method for controlling of certain second phases in aluminum nitride
IBM3 citations60
US5888446AMar 30, 1999
Method of forming an aluminum nitride article utilizing a platinum catalyst
IBM5 citations60
US6638681B2Oct 28, 2003
X-ray printing personalization technique
IBM0 citations52
US5520878AMay 28, 1996
Aluminum nitride body and method for forming said body utilizing a vitreous sintering additive
IBM0 citations51
US6836015B2Dec 28, 2004
Optical assemblies for transmitting and manipulating optical beams
IBM1 citations50
US6306528B1Oct 23, 2001
Method for the controlling of certain second phases in aluminum nitride
IBM0 citations50