Inventor
CHENG TIEN-JEN
US30 patents
⚠️ This page may combine multiple inventors who share the name “CHENG TIEN-JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
22 patentsUS8916448B2Dec 23, 2014
Metal to metal bonding for stacked (3D) integrated circuits
IBM82 citations99
US6534863B2Mar 18, 2003
Common ball-limiting metallurgy for I/O sites
IBM112 citations98
US6927472B2Aug 9, 2005
Fuse structure and method to form the same
IBM20 citations92
US7144490B2Dec 5, 2006
Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer
IBM14 citations84
US7566649B2Jul 28, 2009
Compressible films surrounding solder connectors
IBM8 citations83
US6995084B2Feb 7, 2006
Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
IBM7 citations74
US6924185B2Aug 2, 2005
Fuse structure and method to form the same
IBM6 citations74
US6995475B2Feb 7, 2006
I/C chip suitable for wire bonding
IBM9 citations73
US7332821B2Feb 19, 2008
Compressible films surrounding solder connectors
IBM7 citations72
US6896784B2May 24, 2005
Method for controlling local current to achieve uniform plating thickness
IBM8 citations71
US6890413B2May 10, 2005
Method and apparatus for controlling local current to achieve uniform plating thickness
IBM6 citations71
US9673176B2Jun 6, 2017
Metal to metal bonding for stacked (3D) integrated circuits
IBM1 citations63
US9666563B2May 30, 2017
Metal to metal bonding for stacked (3D) integrated circuits
IBM1 citations63
US7923836B2Apr 12, 2011
BLM structure for application to copper pad
IBM4 citations63
US7473997B2Jan 6, 2009
Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
IBM4 citations62
US6235412B1May 22, 2001
Corrosion-resistant terminal metal pads for thin film packages
IBM4 citations62
US6083375AJul 4, 2000
Process for producing corrosion-resistant terminal metal pads for thin film packages
IBM5 citations62
US6992389B2Jan 31, 2006
Barrier for interconnect and method
IBM4 citations61
US9653431B2May 16, 2017
Metal to metal bonding for stacked (3D) integrated circuits
IBM0 citations52
US9653432B2May 16, 2017
Metal to metal bonding for stacked (3D) integrated circuits
IBM0 citations52
US9515051B2Dec 6, 2016
Metal to metal bonding for stacked (3D) integrated circuits
IBM0 citations52
US7572726B2Aug 11, 2009
Method of forming a bond pad on an I/C chip and resulting structure
IBM0 citations51
CHENG TIEN-JEN
4 patentsUS8415252B2Apr 9, 2013
Selective copper encapsulation layer deposition
CHENG TIEN-JEN7 citations83
US8105937B2Jan 31, 2012
Conformal adhesion promoter liner for metal interconnects
CHENG TIEN-JEN8 citations83
US8444868B2May 21, 2013
Method for removing copper oxide layer
CHENG TIEN-JEN3 citations62
US9017486B2Apr 28, 2015
Deposition chamber cleaning method including stressed cleaning layer
CHENG TIEN-JEN1 citations51