Inventor
SABLINSKI WILLIAM E
US20 patents
⚠️ This page may combine multiple inventors who share the name “SABLINSKI WILLIAM E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
19 patentsUS6283359B1Sep 4, 2001
Method for enhancing fatigue life of ball grid arrays
IBM53 citations96
US6235996B1May 22, 2001
Interconnection structure and process module assembly and rework
IBM65 citations96
US5881945AMar 16, 1999
Multi-layer solder seal band for semiconductor substrates and process
IBM57 citations96
US5881944AMar 16, 1999
Multi-layer solder seal band for semiconductor substrates
IBM53 citations96
US6574859B2Jun 10, 2003
Interconnection process for module assembly and rework
IBM18 citations92
US6518674B2Feb 11, 2003
Temporary attach article and method for temporary attach of devices to a substrate
IBM23 citations92
US6278184B1Aug 21, 2001
Solder disc connection
IBM35 citations92
US6253986B1Jul 3, 2001
Solder disc connection
IBM25 citations92
US6158644ADec 12, 2000
Method for enhancing fatigue life of ball grid arrays
IBM43 citations92
US6070321AJun 6, 2000
Solder disc connection
IBM20 citations92
US5543584AAug 6, 1996
Structure for repairing electrical lines
IBM21 citations92
US5153408AOct 6, 1992
Method and structure for repairing electrical lines
IBM33 citations92
US6429388B1Aug 6, 2002
High density column grid array connections and method thereof
IBM53 citations91
US5605277AFeb 25, 1997
Hot vacuum device removal process and apparatus
IBM18 citations83
US6995084B2Feb 7, 2006
Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
IBM7 citations74
US6303400B1Oct 16, 2001
Temporary attach article and method for temporary attach of devices to a substrate
IBM2 citations63
US7473997B2Jan 6, 2009
Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
IBM4 citations62
US6827505B2Dec 7, 2004
Optoelectronic package structure and process for planar passive optical and optoelectronic devices
IBM4 citations60
US7932342B2Apr 26, 2011
Method to improve wettability by reducing liquid polymer macromolecule mobility through forming polymer blend system
IBM0 citations51