Inventor
HU YONGQI
US36 patents
⚠️ This page may combine multiple inventors who share the name “HU YONGQI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
35 patentsUS6991528B2Jan 31, 2006
Conductive polishing article for electrochemical mechanical polishing
APPLIED MATERIALS INC45 citations96
US7077721B2Jul 18, 2006
Pad assembly for electrochemical mechanical processing
APPLIED MATERIALS INC17 citations93
US6979248B2Dec 27, 2005
Conductive polishing article for electrochemical mechanical polishing
APPLIED MATERIALS INC42 citations93
US7323416B2Jan 29, 2008
Method and composition for polishing a substrate
APPLIED MATERIALS INC20 citations92
US7229535B2Jun 12, 2007
Hydrogen bubble reduction on the cathode using double-cell designs
APPLIED MATERIALS INC25 citations92
US7160432B2Jan 9, 2007
Method and composition for polishing a substrate
APPLIED MATERIALS INC21 citations92
US7128825B2Oct 31, 2006
Method and composition for polishing a substrate
APPLIED MATERIALS INC20 citations92
US6790768B2Sep 14, 2004
Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects
APPLIED MATERIALS INC13 citations92
US7374644B2May 20, 2008
Conductive polishing article for electrochemical mechanical polishing
APPLIED MATERIALS INC13 citations84
US7232514B2Jun 19, 2007
Method and composition for polishing a substrate
APPLIED MATERIALS INC15 citations84
US7207878B2Apr 24, 2007
Conductive polishing article for electrochemical mechanical polishing
APPLIED MATERIALS INC11 citations84
US7084064B2Aug 1, 2006
Full sequence metal and barrier layer electrochemical mechanical processing
APPLIED MATERIALS INC14 citations84
US7582564B2Sep 1, 2009
Process and composition for conductive material removal by electrochemical mechanical polishing
APPLIED MATERIALS INC9 citations83
US7125477B2Oct 24, 2006
Contacts for electrochemical processing
APPLIED MATERIALS INC14 citations82
US6709314B2Mar 23, 2004
Chemical mechanical polishing endpoinat detection
APPLIED MATERIALS INC17 citations82
US7344431B2Mar 18, 2008
Pad assembly for electrochemical mechanical processing
APPLIED MATERIALS INC5 citations74
US6960521B2Nov 1, 2005
Method and apparatus for polishing metal and dielectric substrates
APPLIED MATERIALS INC6 citations73
US7569134B2Aug 4, 2009
Contacts for electrochemical processing
APPLIED MATERIALS INC5 citations72
US7210988B2May 1, 2007
Method and apparatus for reduced wear polishing pad conditioning
APPLIED MATERIALS INC9 citations72
US11161218B2Nov 2, 2021
Window in thin polishing pad
APPLIED MATERIALS INC1 citations71
US10213894B2Feb 26, 2019
Method of placing window in thin polishing pad
APPLIED MATERIALS INC1 citations71
US7699972B2Apr 20, 2010
Method and apparatus for evaluating polishing pad conditioning
APPLIED MATERIALS INC2 citations63
US7303662B2Dec 4, 2007
Contacts for electrochemical processing
APPLIED MATERIALS INC4 citations61
US12330260B2Jun 17, 2025
Polishing pad with secondary window seal
APPLIED MATERIALS INC0 citations60
US11826875B2Nov 28, 2023
Window in thin polishing pad
APPLIED MATERIALS INC0 citations60
US11618124B2Apr 4, 2023
Polishing pad with secondary window seal
APPLIED MATERIALS INC0 citations60
US7678245B2Mar 16, 2010
Method and apparatus for electrochemical mechanical processing
APPLIED MATERIALS INC0 citations52
US7576007B2Aug 18, 2009
Method for electrochemically mechanically polishing a conductive material on a substrate
APPLIED MATERIALS INC0 citations52
US7446041B2Nov 4, 2008
Full sequence metal and barrier layer electrochemical mechanical processing
APPLIED MATERIALS INC0 citations52
US9744640B2Aug 29, 2017
Corrosion resistant retaining rings
APPLIED MATERIALS INC0 citations51
US10744618B2Aug 18, 2020
Polishing pad with secondary window seal
APPLIED MATERIALS INC0 citations50
US9731397B2Aug 15, 2017
Polishing pad with secondary window seal
APPLIED MATERIALS INC0 citations50
US8961266B2Feb 24, 2015
Polishing pad with secondary window seal
APPLIED MATERIALS INC0 citations50
US10029346B2Jul 24, 2018
External clamp ring for a chemical mechanical polishing carrier head
APPLIED MATERIALS INC1 citations45
US10399202B2Sep 3, 2019
Retaining ring for lower wafer defects
APPLIED MATERIALS INC0 citations41