Inventor

TSAI STAN D

US55 patents

⚠️ This page may combine multiple inventors who share the name “TSAI STAN D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSAI STAN D

APPLIED MATERIALS INC

Method and apparatus for enhanced CMP using metals having reductive properties

Method and apparatus for electrochemical-mechanical planarization

Method and apparatus for electrochemical-mechanical planarization

Conductive polishing article for electrochemical mechanical polishing

Conductive polishing article for electrochemical mechanical polishing

Conductive polishing article for electrochemical mechanical polishing

Method and apparatus for enhanced CMP using metals having reductive properties

Pad assembly for electrochemical mechanical processing

Method for chemical mechanical polishing of semiconductor substrates

Solution to metal re-deposition during substrate planarization

Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform

Method and composition for polishing a substrate

Pad assembly for electrochemical mechanical polishing

Conductive polishing article for electrochemical mechanical polishing

Method and composition for polishing a substrate

Method and composition for polishing a substrate

Conductive polishing article for electrochemical mechanical polishing

Pad assembly for electrochemical mechanical processing

Conductive polishing article for electrochemical mechanical polishing

Ion exchange materials for chemical mechanical polishing

Optical monitoring in a two-step chemical mechanical polishing process

Multi-fluid polishing process

Optical monitoring in a two-step chemical mechanical polishing process

Multi-layer polishing pad

Method and composition for polishing a substrate

Conductive polishing article for electrochemical mechanical polishing

Method and composition for polishing a substrate

Conductive polishing article for electrochemical mechanical polishing

Pad assembly for electrochemical mechanical processing

Full sequence metal and barrier layer electrochemical mechanical processing

Control of removal profile in electrochemically assisted CMP

Process and composition for conductive material removal by electrochemical mechanical polishing

Pad assembly for electrochemical mechanical processing

Conductive polishing article for electrochemical mechanical polishing

Tantalum removal during chemical mechanical polishing

Method and apparatus for reduced wear polishing pad conditioning

Method and apparatus for evaluating polishing pad conditioning

Temperature control in a chemical mechanical polishing system

Dual reduced agents for barrier removal in chemical mechanical polishing

Method and apparatus for electroprocessing a substrate with edge profile control

Conductive pad with ion exchange membrane for electrochemical mechanical polishing

Method and apparatus for electrochemical mechanical processing

Method for electrochemically mechanically polishing a conductive material on a substrate

Full sequence metal and barrier layer electrochemical mechanical processing

DHANDAPANI SIVAKUMAR

Closed-loop control for improved polishing pad profiles

Closed-loop control for effective pad conditioning

Method for compensation of variability in chemical mechanical polishing consumables

CHANG SHOU-SUNG

Closed loop control of pad profile based on metrology feedback

DESHPANDE SAMEER

In-situ performance prediction of pad conditioning disk by closed loop torque monitoring

CHEN CHIH HUNG

Polishing pad edge extension