Inventor

CHEN LIANG-YUH

US119 patents

⚠️ This page may combine multiple inventors who share the name “CHEN LIANG-YUH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN LIANG-YUH

APPLIED MATERIALS INC

Process control in electrochemically assisted planarization

In-situ electroless copper seed layer enhancement in an electroplating system

Dual damascene metallization

Dual damascene metallization

Electrolyte composition and treatment for electrolytic chemical mechanical polishing

Planarization of substrates using electrochemical mechanical polishing

Method and apparatus for face-up substrate polishing

Process conditions and precursors for atomic layer deposition (ALD) of AL2O3

Low temperature integrated via and trench fill process and apparatus

Reactive preclean prior to metallization for sub-quarter micron application

Semi-selective chemical vapor deposition

Conductive polishing article for electrochemical mechanical polishing

Apparatus and method for fast-cycle atomic layer deposition

Conductive polishing article for electrochemical mechanical polishing

Conductive polishing article for electrochemical mechanical polishing

Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP

Method of forming copper interconnects

Continuous, non-agglomerated adhesion of a seed layer to a barrier layer

Metallization process and method

Low temperature integrated metallization process and apparatus

Reactive preclean prior to metallization for sub-quarter micron application

Barrier removal at low polish pressure

Pad assembly for electrochemical mechanical processing

Articles for polishing semiconductor substrates

Conductive polishing article for electrochemical mechanical polishing

Method for dishing reduction and feature passivation in polishing processes

Method for chemical mechanical polishing of semiconductor substrates

Single step process for blanket-selective CVD aluminum deposition

Integrated CVD/PVD Al planarization using ultra-thin nucleation layers

Method of forming an interconnect structure

Method and composition for polishing a substrate

Pad assembly for electrochemical mechanical polishing

Conductive polishing article for electrochemical mechanical polishing

Hydrogen bubble reduction on the cathode using double-cell designs

Method and composition for polishing a substrate

Method and composition for polishing a substrate

Method of depositing a material layer

Conductive polishing article for electrochemical mechanical polishing

Pad assembly for electrochemical mechanical processing

Conductive polishing article for electrochemical mechanical polishing

Chemical mechanical polishing with shear force measurement

Method and apparatus for substrate polishing

Endpoint detection for electro chemical mechanical polishing and electropolishing processes

Reactive preclean prior to metallization for sub-quarter micron application

Semi-selective chemical vapor deposition

In-situ capped aluminum plug (CAP) process using selective CVD AL for integrated plug/interconnect metallization

CORNELL RES FOUNDATION INC

Vacuum microelectronic devices with multiple planar electrodes

Microdynamic release structure

Trench-filling etch-masking microfabrication technique

CHEN LIANG YUH

Method for preparing a material of a battery cell