Inventor
PARK GI BUM
KR4 patents
⚠️ This page may combine multiple inventors who share the name “PARK GI BUM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
2 patentsUS6041495AMar 28, 2000
Method of manufacturing a circuit board having metal bumps and a semiconductor device package comprising the same
SAMSUNG ELECTRONICS CO LTD82 citations94
US6245490B1Jun 12, 2001
Method of manufacturing a circuit board having metal bumps and a semiconductor device package comprising the same
SAMSUNG ELECTRONICS CO LTD15 citations82