Inventor
ANG ARTHUR
SG5 patents
Patents
5 patentsUS6232217B1May 15, 2001
Post treatment of via opening by N-containing plasma or H-containing plasma for elimination of fluorine species in the FSG near the surfaces of the via opening
CHARTERED SEMICONDUCTOR MFG81 citations94
US6451687B1Sep 17, 2002
Intermetal dielectric layer for integrated circuits
CHARTERED SEMICONDUCTOR MFG19 citations91
US6653227B1Nov 25, 2003
Method of cobalt silicidation using an oxide-Titanium interlayer
CHARTERED SEMICONDUCTOR MFG21 citations89
US6383922B1May 7, 2002
Thermal stability improvement of CoSi2 film by stuffing in titanium
CHARTERED SEMICONDUCTOR MFG8 citations72
US6528886B2Mar 4, 2003
Intermetal dielectric layer for integrated circuits
CHARTERED SEMICONDUCTOR MFG2 citations61