P

Inventor

NIKAWA KIYOSHI

JP23 patents
⚠️ This page may combine multiple inventors who share the name “NIKAWA KIYOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NEC CORP

15 patents
US6028435AFeb 22, 2000

Semiconductor device evaluation system using optical fiber

NEC CORP159 citations99
US6320396B1Nov 20, 2001

Parasitic MIM structural spot analysis method for semiconductor device and parasitic MIM structure spot analysis method for silicon semiconductor device

NEC CORP109 citations98
US6160407ADec 12, 2000

Inspection method and wiring current observation method for semiconductor device and apparatus of the same

NEC CORP107 citations98
US6444895B1Sep 3, 2002

Device and method for nondestructive inspection on semiconductor device

NEC CORP74 citations96
US6066956AMay 23, 2000

Inspection method and wiring current observation method for semiconductor device

NEC CORP55 citations96
US5804980ASep 8, 1998

Method and system for testing an interconnection in a semiconductor integrated circuit

NEC CORP74 citations96
US5422498AJun 6, 1995

Apparatus for diagnosing interconnections of semiconductor integrated circuits

NEC CORP70 citations94
US5815002ASep 29, 1998

Method and device of testing semiconductor integrated circuit chip capable of preventing electron-hole pairs

NEC CORP45 citations92
US5548211AAug 20, 1996

Dynamic fault imaging system using electron beam and method of analyzing fault

NEC CORP41 citations89
US6593156B2Jul 15, 2003

Non-destructive inspection method

NEC CORP17 citations84
US6137304AOct 24, 2000

Method and device of testing semiconductor integrated circuit chip capable of preventing electron-hole pairs

NEC CORP5 citations74
US4734754AMar 29, 1988

Semiconductor device having improved structure of multi-wiring layers

NEC CORP9 citations74
US5521516AMay 28, 1996

Semiconductor integrated circuit fault analyzing apparatus and method therefor

NEC CORP14 citations72
US6084423AJul 4, 2000

Method and device of testing a semiconductor integrated circuit chip in which a voltage across the semiconductor integrated circuit chip is detected while an ultrasonic wave beam is projected thereon

NEC CORP1 citations63
US6072327AJun 6, 2000

Method and device of testing semiconductor integrated circuit chip capable of preventing electron-hole pairs

NEC CORP2 citations63

NEC ELECTRONICS CORP

7 patents

NIKAWA KIYOSHI

1 patent