Inventor · disambiguated record
Wen-Shan Tsai
Also filed as: TSAI WEN-SHAN
4 granted patents·2 pending applications·15 citations·filing 2002–2019
70Inventor score
Top patents by PatentIndex Score
6 records- 0185US10600708B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Mar 24, 2020·5 cites·8 claims
- 0268US10950520B2Electronic package, method for fabricating the same, and heat dissipatorSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Mar 16, 2021·1 cites·27 claims
- 0357US7459770B2Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Dec 2, 2008·2 cites·8 claims
- 0451US6772805B2In-situ purge system for article containersTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 10, 2004·7 cites·20 claims
- 0537US2019057917A1Electronic package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Application pending·0 cites
- 0636US2014099755A1Fabrication method of stacked package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →