Inventor
CONNELL MICHAEL E
US9 patents
⚠️ This page may combine multiple inventors who share the name “CONNELL MICHAEL E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
8 patentsUS7169685B2Jan 30, 2007
Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive
MICRON TECHNOLOGY INC53 citations95
US6762074B1Jul 13, 2004
Method and apparatus for forming thin microelectronic dies
MICRON TECHNOLOGY INC55 citations94
US7037751B2May 2, 2006
Fabrication of stacked microelectronic devices
MICRON TECHNOLOGY INC26 citations92
US6894380B2May 17, 2005
Packaged stacked semiconductor die and method of preparing same
MICRON TECHNOLOGY INC17 citations92
US6514795B1Feb 4, 2003
Packaged stacked semiconductor die and method of preparing same
MICRON TECHNOLOGY INC25 citations92
US7727785B2Jun 1, 2010
Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive
MICRON TECHNOLOGY INC13 citations83
US6882036B2Apr 19, 2005
Apparatuses for forming thin microelectronic dies
MICRON TECHNOLOGY INC8 citations72
US7297412B2Nov 20, 2007
Fabrication of stacked microelectronic devices
MICRON TECHNOLOGY INC2 citations62