Inventor
HONDA NORIYUKI
JP29 patents
⚠️ This page may combine multiple inventors who share the name “HONDA NORIYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MEINAN MACHINERY WORKS
13 patentsUS5875710AMar 2, 1999
Veneer-pressing apparatus
MEINAN MACHINERY WORKS25 citations92
US4675066AJun 23, 1987
Method of bonding veneer sheets and apparatus therefor
MEINAN MACHINERY WORKS19 citations82
US6878230B2Apr 12, 2005
Method of manufacturing glued laminated wood
MEINAN MACHINERY WORKS18 citations80
US4483730ANov 20, 1984
Plywood manufacturing method and apparatus
MEINAN MACHINERY WORKS13 citations74
US4811496AMar 14, 1989
Method of correcting the track of an intermittently-running endless belt in a veneer dryer
MEINAN MACHINERY WORKS15 citations72
US5562281AOct 8, 1996
Leading end stacked position regulating apparatus in thin sheet material stacker
MEINAN MACHINERY WORKS15 citations71
US6363845B1Apr 2, 2002
Method of transferring a sheet through a working apparatus
MEINAN MACHINERY WORKS3 citations63
US4569715AFeb 11, 1986
Plywood manufacturing method and apparatus
MEINAN MACHINERY WORKS3 citations63
US5848483ADec 15, 1998
Veneer heating apparatus using hot plates and steam escape means
MEINAN MACHINERY WORKS5 citations62
US4827630AMay 9, 1989
Heating plate in a veneer dryer
MEINAN MACHINERY WORKS5 citations61
US7401632B2Jul 22, 2008
Method and apparatus of pressing in manufacturing glued laminated wood
MEINAN MACHINERY WORKS3 citations59
US7946321B2May 24, 2011
Method of holding a veneer sheet
MEINAN MACHINERY WORKS0 citations38
US7160414B2Jan 9, 2007
Method and apparatus of manufacturing glued laminated wood
MEINAN MACHINERY WORKS0 citations38
SONY CORP
10 patentsUS6365840B1Apr 2, 2002
Electrical connecting device and electrical connecting method
SONY CORP44 citations95
US7005743B2Feb 28, 2006
Semiconductor device using bumps, method for fabricating same, and method for forming bumps
SONY CORP25 citations92
US6332786B1Dec 25, 2001
Electrical connection device employing an anisotropic electrically conductive film
SONY CORP22 citations92
US6376050B1Apr 23, 2002
Electric connecting method and apparatus
SONY CORP22 citations88
US7015131B2Mar 21, 2006
Semiconductor device using bumps, method for fabricating same, and method for forming bumps
SONY CORP4 citations73
US6812569B2Nov 2, 2004
Semiconductor device using bumps, method for fabricating same, and method for forming bumps
SONY CORP6 citations73
US6614111B2Sep 2, 2003
Semiconductor device using bumps, method for fabricating same, and method for forming bumps
SONY CORP11 citations73
US7244675B2Jul 17, 2007
Electrical connection materials and electrical connection method
SONY CORP7 citations71
US6835274B2Dec 28, 2004
Electrical connecting device and electrical connecting method
SONY CORP4 citations62
US7078807B2Jul 18, 2006
Electrical connection materials and electrical connection methods
SONY CORP2 citations60