Inventor
HSU YOU-MING
TW11 patents
⚠️ This page may combine multiple inventors who share the name “HSU YOU-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIPBOND TECHNOLOGY CORP
9 patentsUS8347490B1Jan 8, 2013
Method for fabricating a carrier with a three dimensional inductor
CHIPBOND TECHNOLOGY CORP7 citations82
US12424551B2Sep 23, 2025
Semiconductor structure and method of manufacturing the same
CHIPBOND TECHNOLOGY CORP0 citations61
US11651974B2May 16, 2023
Semiconductor package and method of fabricating the same
CHIPBOND TECHNOLOGY CORP1 citations61
US8513772B2Aug 20, 2013
Method for fabricating a three-dimensional inductor carrier with metal core and structure thereof
CHIPBOND TECHNOLOGY CORP2 citations61
US8981536B1Mar 17, 2015
Semiconductor structure
CHIPBOND TECHNOLOGY CORP3 citations59
US8963675B2Feb 24, 2015
Method for fabricating a carrier with a three dimensional inductor and structure thereof
CHIPBOND TECHNOLOGY CORP0 citations51
US8772644B2Jul 8, 2014
Carrier with three-dimensional capacitor
CHIPBOND TECHNOLOGY CORP0 citations40
US9000569B2Apr 7, 2015
Semiconductor structure
CHIPBOND TECHNOLOGY CORP0 citations38
US8796824B1Aug 5, 2014
Semiconductor structure
CHIPBOND TECHNOLOGY CORP0 citations38