Inventor

LIAO KAO-FENG

TW17 patents

⚠️ This page may combine multiple inventors who share the name “LIAO KAO-FENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIAO KAO-FENG

TAIWAN SEMICONDUCTOR MFG CO LTD

CMP-friendly coatings for planar recessing or removing of variable-height layers

Semiconductor structure with doped contact plug and method for forming the same

Chemical mechanical planarization tool

Composition and method for polishing and integrated circuit

Semiconductor device structure with an interconnect structure in a dielectric layer with multiple hydrophobic layers along sidewalls of the dielectric layer, and method for forming the same

Semiconductor device structure with interconnect structure and method for forming the same

Semiconductor device structure with interconnect structure and method for forming the same

Chemical mechanical polish slurry and method of manufacture

Slurry composition and method for polishing and integrated circuit

Chemical mechanical polishing method

Chemical mechanical polishing method

Chemical mechanical polish slurry and method of manufacture

Chemical mechanical planarization tool

FinFET contacts and method forming same

Chemical mechanical polishing method

Wafer cleaning module

IND TECH RES INST

Construction of thin strain-relaxed SiGe layers and method for fabricating the same