Inventor
CHEN LIH-JUANN
TW10 patents
⚠️ This page may combine multiple inventors who share the name “CHEN LIH-JUANN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
4 patentsUS6043148AMar 28, 2000
Method of fabricating contact plug
UNITED MICROELECTRONICS CORP21 citations89
US6417118B1Jul 9, 2002
Method for improving the moisture absorption of porous low dielectric film
UNITED MICROELECTRONICS CORP16 citations82
US5897373AApr 27, 1999
Method of manufacturing semiconductor components having a titanium nitride layer
UNITED MICROELECTRONICS CORP7 citations73
US6022457AFeb 8, 2000
Method of manufacturing cobalt silicide layer
UNITED MICROELECTRONICS CORP11 citations71
IND TECH RES INST
3 patentsUS7202512B2Apr 10, 2007
Construction of thin strain-relaxed SiGe layers and method for fabricating the same
IND TECH RES INST417 citations97
US7498224B2Mar 3, 2009
Strained silicon forming method with reduction of threading dislocation density
IND TECH RES INST1 citations51
US7102153B2Sep 5, 2006
Strained silicon forming method with reduction of threading dislocation density
IND TECH RES INST0 citations51
TAIWAN SEMICONDUCTOR MFG
2 patentsUS6015749AJan 18, 2000
Method to improve adhesion between copper and titanium nitride, for copper interconnect structures, via the use of an ion implantation procedure
TAIWAN SEMICONDUCTOR MFG104 citations97
US6083829AJul 4, 2000
Use of a low resistivity Cu3 Ge interlayer as an adhesion promoter between copper and tin layers
TAIWAN SEMICONDUCTOR MFG16 citations83