Inventor
TOMITA HIDESHI
JP20 patents
⚠️ This page may combine multiple inventors who share the name “TOMITA HIDESHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NISSHIN SPINNING
18 patentsUS6818097B2Nov 16, 2004
Highly heat-resistant plasma etching electrode and dry etching device including the same
NISSHIN SPINNING45 citations92
US6486266B2Nov 26, 2002
Thermosetting resin composition
NISSHIN SPINNING16 citations92
US6440258B1Aug 27, 2002
Adhesive film for semiconductor package
NISSHIN SPINNING22 citations92
US6103836AAug 15, 2000
Epoxy resin composition
NISSHIN SPINNING19 citations92
US5679730AOct 21, 1997
Epoxy resin composition and epoxy resin-based adhesive
NISSHIN SPINNING18 citations92
US6333101B1Dec 25, 2001
Method of adhering adherends
NISSHIN SPINNING7 citations74
US6485833B1Nov 26, 2002
Resin-coated metal foil
NISSHIN SPINNING9 citations73
US6387505B1May 14, 2002
Prepreg, multilayer printed wiring board and process for production of said multilayer printed wiring board
NISSHIN SPINNING7 citations73
US6331226B1Dec 18, 2001
LCP bonding method
NISSHIN SPINNING11 citations73
US6300425B1Oct 9, 2001
Thermosetting resin composition
NISSHIN SPINNING6 citations73
US6225417B1May 1, 2001
One-pack type epoxy resin composition
NISSHIN SPINNING6 citations73
US6172143B1Jan 9, 2001
Resin composition for use in sealant and liquid sealant using the resin composition
NISSHIN SPINNING9 citations73
US5650476AJul 22, 1997
Process for production of polycarbodiimide resin powder
NISSHIN SPINNING11 citations73
US6979703B2Dec 27, 2005
Acoustically matching layer and composition thereof
NISSHIN SPINNING3 citations63
US6524711B2Feb 25, 2003
Thermosetting resin composition, and resin-covered metal foil, prepreg and film-shaped adhesive all using the composition
NISSHIN SPINNING4 citations62
US6140454AOct 31, 2000
Adhesive resin composition and sealing resin composition
NISSHIN SPINNING4 citations62
US7253246B2Aug 7, 2007
Thermosetting polycarbodiimide copolymer
NISSHIN SPINNING0 citations52
US6310119B1Oct 30, 2001
Film-shaped encapsulating agent for electronic parts
NISSHIN SPINNING1 citations52