Inventor

HSU HSIAO-TING

TW23 patents

⚠️ This page may combine multiple inventors who share the name “HSU HSIAO-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSU HSIAO-TING

AVARY HOLDING SHENZHEN CO LTD

Method of making flexible circuit board

Pressure sensor, pressure-sensitive circuit board, and manufacturing method for pressure-sensitive circuit board

Heat equalization plate

Pressure sensing circuit board and method for manufacturing the same

Heat equalization plate and method for manufacturing the same

Transparent PCB and method for manufacturing the same

Covering film, and circuit board and manufacturing method

Method for making a heat dissipation structure

Circuit board with embedded electronic component and method for manufacturing the same

Flexible battery assembly and method for manufacturing the same

Method of manufacturing physical structure for high frequency signal transmission

Flexible circuit board

Circuit board having conductive polymer

Cooling plate and method for manufacturing thereof

QING DING PREC ELECTRONICS HUAIAN CO LTD

Circuit board and manufacturing method thereof

Electromagnetic shielding film

Circuit board and manufacturing method thereof

Circuit board with heat dissipation structure and method for manufacturing same

Method of manufacturing circuit board

Circuit board for transmitting high-frequency signal and method for manufacturing the same

FUKUI PREC COMPONENT (SHENZHEN) CO LTD

Method for making conductive polymer, and composite film and circuit board having the conductive polymer

QING DING PREC ELECTRONICS (HUAIAN) CO LTD

Resin composition, adhesive layer, and circuit board utilizing same

FUKUI PREC COMPONENT SHENZHEN

Heat dissipation structure, method for making the same, and electronic device having the same