Inventor
ZHAO ALLEN
CN23 patents
⚠️ This page may combine multiple inventors who share the name “ZHAO ALLEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
18 patentsUS6331380B1Dec 18, 2001
Method of pattern etching a low K dielectric layer
APPLIED MATERIALS INC159 citations98
US6143476ANov 7, 2000
Method for high temperature etching of patterned layers using an organic mask stack
APPLIED MATERIALS INC186 citations98
US6080529AJun 27, 2000
Method of etching patterned layers useful as masking during subsequent etching or for damascene structures
APPLIED MATERIALS INC551 citations98
US6458516B1Oct 1, 2002
Method of etching dielectric layers using a removable hardmask
APPLIED MATERIALS INC113 citations97
US6352081B1Mar 5, 2002
Method of cleaning a semiconductor device processing chamber after a copper etch process
APPLIED MATERIALS INC252 citations97
US6204168B1Mar 20, 2001
Damascene structure fabricated using a layer of silicon-based photoresist material
APPLIED MATERIALS INC113 citations97
US6514857B1Feb 4, 2003
Damascene structure fabricated using a layer of silicon-based photoresist material
APPLIED MATERIALS INC57 citations95
US6008140ADec 28, 1999
Copper etch using HCI and HBr chemistry
APPLIED MATERIALS INC47 citations95
US5779926AJul 14, 1998
Plasma process for etching multicomponent alloys
APPLIED MATERIALS INC62 citations95
US5753044AMay 19, 1998
RF plasma reactor with hybrid conductor and multi-radius dome ceiling
APPLIED MATERIALS INC91 citations95
US6270617B1Aug 7, 2001
RF plasma reactor with hybrid conductor and multi-radius dome ceiling
APPLIED MATERIALS INC48 citations94
US6547978B2Apr 15, 2003
Method of heating a semiconductor substrate
APPLIED MATERIALS INC26 citations92
US6534416B1Mar 18, 2003
Control of patterned etching in semiconductor features
APPLIED MATERIALS INC15 citations92
US5777289AJul 7, 1998
RF plasma reactor with hybrid conductor and multi-radius dome ceiling
APPLIED MATERIALS INC35 citations92
US6825562B2Nov 30, 2004
Damascene structure fabricated using a layer of silicon-based photoresist material
APPLIED MATERIALS INC14 citations91
US6248250B1Jun 19, 2001
RF plasma reactor with hybrid conductor and multi-radius dome ceiling
APPLIED MATERIALS INC29 citations91
US6475335B1Nov 5, 2002
RF plasma reactor with hybrid conductor and multi-radius dome ceiling
APPLIED MATERIALS INC18 citations90
US6489247B1Dec 3, 2002
Copper etch using HCl and HBR chemistry
APPLIED MATERIALS INC11 citations73
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG
2 patentsUS12507350B2Dec 23, 2025
Manufacturing component carrier with cavity by trimming poorly adhesive structure before removing stack material
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG0 citations58
US12490382B2Dec 2, 2025
Coreless component carrier with embedded components
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG0 citations52