Inventor
MORI RYUICHIRO
JP10 patents
Patents
10 patentsUS6369447B2Apr 9, 2002
Plastic-packaged semiconductor device including a plurality of chips
MITSUBISHI ELECTRIC CORP206 citations98
US5903049AMay 11, 1999
Semiconductor module comprising semiconductor packages
MITSUBISHI ELECTRIC CORP267 citations98
US4942454AJul 17, 1990
Resin sealed semiconductor device
MITSUBISHI ELECTRIC CORP257 citations96
US5139969AAug 18, 1992
Method of making resin molded semiconductor device
MITSUBISHI ELECTRIC CORP96 citations95
US6163070ADec 19, 2000
Semiconductor package utilizing a flexible wiring substrate
MITSUBISHI ELECTRIC CORP20 citations92
US4884124ANov 28, 1989
Resin-encapsulated semiconductor device
MITSUBISHI ELECTRIC CORP44 citations91
US4857989AAug 15, 1989
Semiconductor device
MITSUBISHI ELECTRIC CORP21 citations81
US5659199AAug 19, 1997
Resin sealed semiconductor device
MITSUBISHI ELECTRIC CORP17 citations73
US4878610ANov 7, 1989
Die bonding apparatus
MITSUBISHI ELECTRIC CORP10 citations71
US5042123AAug 27, 1991
Computer controlled automated semiconductor production apparatus
MITSUBISHI ELECTRIC CORP2 citations62