Inventor
RAJAGOPALAN NAGARAJAN
US26 patents
⚠️ This page may combine multiple inventors who share the name “RAJAGOPALAN NAGARAJAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
21 patentsUS9157730B2Oct 13, 2015
PECVD process
APPLIED MATERIALS INC49 citations97
US6656840B2Dec 2, 2003
Method for forming silicon containing layers on a substrate
APPLIED MATERIALS INC54 citations93
US9816187B2Nov 14, 2017
PECVD process
APPLIED MATERIALS INC8 citations92
US9458537B2Oct 4, 2016
PECVD process
APPLIED MATERIALS INC12 citations92
US7229911B2Jun 12, 2007
Adhesion improvement for low k dielectrics to conductive materials
APPLIED MATERIALS INC24 citations92
US7297376B1Nov 20, 2007
Method to reduce gas-phase reactions in a PECVD process with silicon and organic precursors to deposit defect-free initial layers
APPLIED MATERIALS INC33 citations90
US10793954B2Oct 6, 2020
PECVD process
APPLIED MATERIALS INC3 citations84
US10060032B2Aug 28, 2018
PECVD process
APPLIED MATERIALS INC3 citations84
US7410916B2Aug 12, 2008
Method of improving initiation layer for low-k dielectric film by digital liquid flow meter
APPLIED MATERIALS INC9 citations84
US7371427B2May 13, 2008
Reduction of hillocks prior to dielectric barrier deposition in Cu damascene
APPLIED MATERIALS INC11 citations84
US11613812B2Mar 28, 2023
PECVD process
APPLIED MATERIALS INC2 citations73
US7723228B2May 25, 2010
Reduction of hillocks prior to dielectric barrier deposition in Cu damascene
APPLIED MATERIALS INC6 citations73
US9490116B2Nov 8, 2016
Gate stack materials for semiconductor applications for lithographic overlay improvement
APPLIED MATERIALS INC3 citations70
US7947611B2May 24, 2011
Method of improving initiation layer for low-k dielectric film by digital liquid flow meter
APPLIED MATERIALS INC2 citations63
US11898249B2Feb 13, 2024
PECVD process
APPLIED MATERIALS INC0 citations62
US10030306B2Jul 24, 2018
PECVD apparatus and process
APPLIED MATERIALS INC1 citations62
US11894228B2Feb 6, 2024
Treatments for controlling deposition defects
APPLIED MATERIALS INC0 citations53
US10475644B2Nov 12, 2019
Dielectric-metal stack for 3D flash memory application
APPLIED MATERIALS INC0 citations51
US9972487B2May 15, 2018
Dielectric-metal stack for 3D flash memory application
APPLIED MATERIALS INC1 citations51
US12195846B2Jan 14, 2025
Modified stacks for 3D NAND
APPLIED MATERIALS INC0 citations45
US9896326B2Feb 20, 2018
FCVD line bending resolution by deposition modulation
APPLIED MATERIALS INC0 citations41
RAJAGOPALAN NAGARAJAN
4 patentsUS8076250B1Dec 13, 2011
PECVD oxide-nitride and oxide-silicon stacks for 3D memory application
RAJAGOPALAN NAGARAJAN488 citations97
US8563095B2Oct 22, 2013
Silicon nitride passivation layer for covering high aspect ratio features
RAJAGOPALAN NAGARAJAN11 citations81
US8329575B2Dec 11, 2012
Fabrication of through-silicon vias on silicon wafers
RAJAGOPALAN NAGARAJAN6 citations81
US8283237B2Oct 9, 2012
Fabrication of through-silicon vias on silicon wafers
RAJAGOPALAN NAGARAJAN11 citations81