Inventor
RUDIK WILLIAM J
US17 patents
⚠️ This page may combine multiple inventors who share the name “RUDIK WILLIAM J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
16 patentsUS5126192AJun 30, 1992
Flame retardant, low dielectric constant microsphere filled laminate
IBM151 citations98
US6074895AJun 13, 2000
Method of forming a flip chip assembly
IBM63 citations95
US6781064B1Aug 24, 2004
Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same
IBM16 citations92
US6348738B1Feb 19, 2002
Flip chip assembly
IBM17 citations92
US6306683B1Oct 23, 2001
Method of forming a flip chip assembly, and a flip chip assembly formed by the method
IBM16 citations92
US6834426B1Dec 28, 2004
Method of fabricating a laminate circuit structure
IBM18 citations91
US6399896B1Jun 4, 2002
Circuit package having low modulus, conformal mounting pads
IBM51 citations90
US4855333AAug 8, 1989
Multiple wire photosensitive adhesive for wire embedment
IBM23 citations79
US7148566B2Dec 12, 2006
Method and structure for an organic package with improved BGA life
IBM7 citations74
US6639638B1Oct 28, 2003
LCD cover optical structure and method
IBM10 citations74
US6534848B1Mar 18, 2003
Electrical coupling of a stiffener to a chip carrier
IBM11 citations71
US6469256B1Oct 22, 2002
Structure for high speed printed wiring boards with multiple differential impedance-controlled layers
IBM10 citations71
US4544801AOct 1, 1985
Circuit board including multiple wire photosensitive adhesive
IBM15 citations71
US7615477B2Nov 10, 2009
Method of fabricating a BGA package having decreased adhesion
IBM1 citations52
US6845557B2Jan 25, 2005
Method for producing an electronic package possessing controlled impedance characteristics
IBM1 citations49
US6699736B2Mar 2, 2004
Electrical coupling of a stiffener to a chip carrier
IBM0 citations49