Inventor
VU QUAT
US6 patents
Patents
6 patentsUS7189596B1Mar 13, 2007
Process for forming a direct build-up layer on an encapsulated die packages utilizing intermediate structures
INTEL CORP151 citations97
US6586836B1Jul 1, 2003
Process for forming microelectronic packages and intermediate structures formed therewith
INTEL CORP111 citations96
US6238954B1May 29, 2001
COF packaged semiconductor
INTEL CORP17 citations91
US5909635AJun 1, 1999
Cladding of an interconnect for improved electromigration performance
INTEL CORP21 citations91
US6656822B2Dec 2, 2003
Method for reduced capacitance interconnect system using gaseous implants into the ILD
INTEL CORP39 citations89
US6737754B2May 18, 2004
COF packaged semiconductor
INTEL CORP5 citations61