Inventor
OKEYUI TAKUJI
JP15 patents
⚠️ This page may combine multiple inventors who share the name “OKEYUI TAKUJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NITTO DENKO CORP
10 patentsUS6373000B2Apr 16, 2002
Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board
NITTO DENKO CORP55 citations95
US7262514B2Aug 28, 2007
Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device
NITTO DENKO CORP25 citations92
US6335076B1Jan 1, 2002
Multi-layer wiring board and method for manufacturing the same
NITTO DENKO CORP26 citations92
US6333469B1Dec 25, 2001
Wafer-scale package structure and circuit board attached thereto
NITTO DENKO CORP34 citations92
US7064011B2Jun 20, 2006
Semiconductor device fabricating apparatus and semiconductor device fabricating method
NITTO DENKO CORP21 citations91
US7235888B2Jun 26, 2007
Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device
NITTO DENKO CORP15 citations84
US7132755B2Nov 7, 2006
Adhesive film for manufacturing semiconductor device
NITTO DENKO CORP11 citations83
US6858473B2Feb 22, 2005
Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device
NITTO DENKO CORP12 citations80
US6245188B1Jun 12, 2001
Process for the removal of resist material
NITTO DENKO CORP12 citations73
US6565704B2May 20, 2003
Process for the removal of resist material
NITTO DENKO CORP0 citations52
DAINIPPON PRINTING CO LTD
3 patentsUS7365441B2Apr 29, 2008
Semiconductor device fabricating apparatus and semiconductor device fabricating method
DAINIPPON PRINTING CO LTD15 citations82
US8018044B2Sep 13, 2011
Semiconductor device, substrate for producing semiconductor device and method of producing them
DAINIPPON PRINTING CO LTD3 citations61
US7943427B2May 17, 2011
Semiconductor device, substrate for producing semiconductor device and method of producing them
DAINIPPON PRINTING CO LTD0 citations40