Inventor

KIM YOUNGCHEOL

KR21 patents

⚠️ This page may combine multiple inventors who share the name “KIM YOUNGCHEOL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM YOUNGCHEOL

STATS CHIPPAC PTE LTD

Semiconductor device and method of making double shielding layers over the semiconductor device

Semiconductor device and method of forming hybrid TIM layers

Semiconductor device and method of integrating RF antenna interposer with semiconductor package

Semiconductor device and method of forming hybrid TIM layers

Semiconductor device and method of integrating RF antenna interposer with semiconductor package

Semiconductor device and method of making a photonic semiconductor package

Semiconductor device and method of compartment shielding using bond wires

Semiconductor device and method of compartment shielding using bond wires

CHIPPAC INC

Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package

Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package

Method for making semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package

STATS CHIPPAC LTD

Stacked integrated circuit and package system

Thin package system with external terminals

Flip chip interconnection structure with bump on partial pad and method thereof

PENDSE RAJENDRA D

Filp chip interconnection structure with bump on partial pad and method thereof

CHOW SENG GUAN

Integrated circuit packaging system with reinforced encapsulant having embedded interconnect and method of manufacture thereof

KEYANG ELECTRIC MACHINERY CO LTD

Motor including tension member

YANG DAEWOOK

Integrated circuit package system with mold gate

JEONG TAE SUNG

Stacked integrated circuit and package system and method for manufacturing thereof

KIM YOUNGCHEOL

Thin package system with external terminals and method of manufacture thereof

HWANG KWANG SOON

Inter-stacking module system