Inventor
HOSOKAWA YOUICHI
JP16 patents
⚠️ This page may combine multiple inventors who share the name “HOSOKAWA YOUICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SUMITOMO OSAKA CEMENT CO LTD
10 patentsUS10185165B2Jan 22, 2019
Optical waveguide device
SUMITOMO OSAKA CEMENT CO LTD6 citations72
US10078253B2Sep 18, 2018
Optical modulator
SUMITOMO OSAKA CEMENT CO LTD6 citations72
US10025121B2Jul 17, 2018
Optical waveguide element module
SUMITOMO OSAKA CEMENT CO LTD3 citations72
US9778539B2Oct 3, 2017
Optical modulation device
SUMITOMO OSAKA CEMENT CO LTD4 citations72
US9570879B2Feb 14, 2017
Optical pulse-generator and optical pulse-generating method
SUMITOMO OSAKA CEMENT CO LTD3 citations72
US9250455B2Feb 2, 2016
Optical modulator
SUMITOMO OSAKA CEMENT CO LTD4 citations72
US8909001B2Dec 9, 2014
Optical modulator
SUMITOMO OSAKA CEMENT CO LTD6 citations72
US9977270B2May 22, 2018
Optical device
SUMITOMO OSAKA CEMENT CO LTD2 citations71
US9523872B2Dec 20, 2016
Optical device
SUMITOMO OSAKA CEMENT CO LTD2 citations62
US10162201B2Dec 25, 2018
Optical modulator
SUMITOMO OSAKA CEMENT CO LTD1 citations51
HITACHI CHEMICAL CO LTD
4 patentsUS6523446B1Feb 25, 2003
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
HITACHI CHEMICAL CO LTD13 citations81
US7947779B2May 24, 2011
Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer
HITACHI CHEMICAL CO LTD3 citations61
US7449076B2Nov 11, 2008
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
HITACHI CHEMICAL CO LTD0 citations49
US7273654B2Sep 25, 2007
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
HITACHI CHEMICAL CO LTD0 citations49