Inventor
OH TAC KEUN
KR14 patents
⚠️ This page may combine multiple inventors who share the name “OH TAC KEUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SK HYNIX INC
7 patentsUS9570370B2Feb 14, 2017
Multi chip package and method for manufacturing the same
SK HYNIX INC3 citations73
US9716017B2Jul 25, 2017
Semiconductor packages including interposer and methods of manufacturing the same
SK HYNIX INC2 citations72
US9299689B2Mar 29, 2016
Methods of fabricating semiconductor stack packages
SK HYNIX INC6 citations72
US8803327B2Aug 12, 2014
Semiconductor package
SK HYNIX INC6 citations72
US9257413B2Feb 9, 2016
Stack packages including diffusion barriers over sidewalls of through via electrodes and methods of manufacturing the same
SK HYNIX INC4 citations69
US9508699B2Nov 29, 2016
Semiconductor package and method for manufacturing the same
SK HYNIX INC2 citations62
US9406584B2Aug 2, 2016
Semiconductor package and method for manufacturing the same
SK HYNIX INC2 citations62
OH TAC KEUN
3 patentsUS8618656B2Dec 31, 2013
Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same
OH TAC KEUN34 citations91
US8198136B2Jun 12, 2012
Stacked semiconductor package electrically connecting semiconductor chips using outer surfaces thereof and method for manufacturing the same
OH TAC KEUN8 citations82
US8624241B2Jan 7, 2014
Semiconductor chip, stack-type semiconductor package
OH TAC KEUN3 citations60
HYNIX SEMICONDUCTOR INC
2 patentsUS7838979B2Nov 23, 2010
Stacked semiconductor package electrically connecting semiconductor chips using outer surfaces thereof and method for manufacturing the same
HYNIX SEMICONDUCTOR INC34 citations91
US8049332B2Nov 1, 2011
Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same
HYNIX SEMICONDUCTOR INC6 citations73