Inventor
TAKASHITA HIROMITSU
JP11 patents
⚠️ This page may combine multiple inventors who share the name “TAKASHITA HIROMITSU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PANASONIC CORP
8 patentsUS9351402B2May 24, 2016
Circuit board, and semiconductor device having component mounted on circuit board
PANASONIC CORP4 citations72
US9070393B2Jun 30, 2015
Three-dimensional structure in which wiring is provided on its surface
PANASONIC CORP6 citations72
US9082438B2Jul 14, 2015
Three-dimensional structure for wiring formation
PANASONIC CORP2 citations62
US9332642B2May 3, 2016
Circuit board
PANASONIC CORP0 citations51
US9082825B2Jul 14, 2015
Manufacturing method for semiconductor package, semiconductor package, and semiconductor device
PANASONIC CORP1 citations51
US9204530B2Dec 1, 2015
Electronic components assembly
PANASONIC CORP0 citations50
US9175151B2Nov 3, 2015
Resin composition and method for producing circuit board
PANASONIC CORP0 citations50
US9669567B2Jun 6, 2017
Manufacturing method of molded article
PANASONIC CORP0 citations40
YOSHIOKA SHINGO
2 patentsUS8929092B2Jan 6, 2015
Circuit board, and semiconductor device having component mounted on circuit board
YOSHIOKA SHINGO10 citations83
US9082635B2Jul 14, 2015
Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module and multilayer circuit board
YOSHIOKA SHINGO1 citations50