Inventor

HUNG SHENG-WEI

TW3 patents

Patents

3 patents

US10340230B1Jul 2, 2019

Semiconductor chip

UNITED MICROELECTRONICS CORP1 citations55

US10640372B2May 5, 2020

Method for fabricating MEMS device integrated with a semiconductor integrated circuit

UNITED MICROELECTRONICS CORP0 citations46

US10472232B2Nov 12, 2019

MEMS device integrated with a semiconductor integrated circuit and manufacturing method thereof

UNITED MICROELECTRONICS CORP0 citations46