Inventor
YEOM KUN-DAE
KR11 patents
⚠️ This page may combine multiple inventors who share the name “YEOM KUN-DAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
7 patentsUS7391105B2Jun 24, 2008
Unit semiconductor chip and multi chip package with center bonding pads and methods for manufacturing the same
SAMSUNG ELECTRONICS CO LTD161 citations97
US8901750B2Dec 2, 2014
Semiconductor package including multiple chips and separate groups of leads
SAMSUNG ELECTRONICS CO LTD12 citations92
US7759795B2Jul 20, 2010
Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD2 citations58
US10607905B2Mar 31, 2020
Package substrate for a semiconductor package having landing pads extending toward a through-hole in a chip mounting region
SAMSUNG ELECTRONICS CO LTD1 citations57
US10361135B2Jul 23, 2019
Semiconductor package including landing pads extending at an oblique angle toward a through-hole in the package substrate
SAMSUNG ELECTRONICS CO LTD1 citations57
US9455217B2Sep 27, 2016
Semiconductor package including multiple chips and separate groups of leads
SAMSUNG ELECTRONICS CO LTD0 citations51
US7521289B2Apr 21, 2009
Package having dummy package substrate and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations51