Inventor

FEE SETHO SING

SG30 patents

⚠️ This page may combine multiple inventors who share the name “FEE SETHO SING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FEE SETHO SING

MICRON TECHNOLOGY INC

Methods for assembling multiple semiconductor devices

Quad flat no lead (QFN) grid array package, method of making and memory module and computer system including same

Packaged microelectronic component assemblies

Semiconductor device assemblies and packages including multiple semiconductor devices and methods

Packaged microelectronic devices and methods of forming same

Semiconductor device assemblies and packages including multiple semiconductor device components

Quad flat no lead (QFN) grid array package

Packaged microelectronic devices and methods of forming same

Ball grid array interposer, packages and methods

Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same

Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same

Interposer with a lateral recess in a slot to facilitate connection of intermediate conductive elements to bond pads of a semiconductor die with which the interposer is assembled

Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate

Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts

Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers

Ultrathin leadframe BGA circuit package

Methods of forming integrated circuit packages, and methods of assembling integrated circuit packages

Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts

Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate

Methods for assembling semiconductor devices and interposers

Ultrathin leadframe BGA circuit package

Methods of forming integrated circuit packages

Methods of assembling integrated circuit packages

Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers

ST ASSEMBLY TEST SERVICES PTE

Heat spreader hole pin 1 identifier

Enhanced BGA grounded heatsink

FEE SETHO SING

Integrated circuit packages

Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts

ST ASSEMBLY TEST SERVICE LTD

Enhanced BGA grounded heatsink

ST ASSEMBLY TEST SERVICES LTD

Heat spreader hole pin 1 identifier