Inventor
YEAN TAY WUU
SG13 patents
⚠️ This page may combine multiple inventors who share the name “YEAN TAY WUU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
11 patentsUS7198980B2Apr 3, 2007
Methods for assembling multiple semiconductor devices
MICRON TECHNOLOGY INC230 citations99
US6906415B2Jun 14, 2005
Semiconductor device assemblies and packages including multiple semiconductor devices and methods
MICRON TECHNOLOGY INC203 citations99
US7573136B2Aug 11, 2009
Semiconductor device assemblies and packages including multiple semiconductor device components
MICRON TECHNOLOGY INC128 citations98
US7145228B2Dec 5, 2006
Microelectronic devices
MICRON TECHNOLOGY INC104 citations97
US6946325B2Sep 20, 2005
Methods for packaging microelectronic devices
MICRON TECHNOLOGY INC344 citations97
US6913476B2Jul 5, 2005
Temporary, conformable contacts for microelectronic components
MICRON TECHNOLOGY INC75 citations97
US6870247B2Mar 22, 2005
Interposer with a lateral recess in a slot to facilitate connection of intermediate conductive elements to bond pads of a semiconductor die with which the interposer is assembled
MICRON TECHNOLOGY INC12 citations92
US6773960B2Aug 10, 2004
Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate
MICRON TECHNOLOGY INC21 citations92
US7947529B2May 24, 2011
Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods
MICRON TECHNOLOGY INC13 citations84
US6951777B2Oct 4, 2005
Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate
MICRON TECHNOLOGY INC7 citations74
US7112876B2Sep 26, 2006
Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers
MICRON TECHNOLOGY INC3 citations63