Inventor
CHYE LIM THIAM
SG26 patents
⚠️ This page may combine multiple inventors who share the name “CHYE LIM THIAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
25 patentsUS7198980B2Apr 3, 2007
Methods for assembling multiple semiconductor devices
MICRON TECHNOLOGY INC230 citations99
US6967125B2Nov 22, 2005
Quad flat no lead (QFN) grid array package, method of making and memory module and computer system including same
MICRON TECHNOLOGY INC94 citations99
US6951982B2Oct 4, 2005
Packaged microelectronic component assemblies
MICRON TECHNOLOGY INC159 citations99
US6906415B2Jun 14, 2005
Semiconductor device assemblies and packages including multiple semiconductor devices and methods
MICRON TECHNOLOGY INC203 citations99
US6876066B2Apr 5, 2005
Packaged microelectronic devices and methods of forming same
MICRON TECHNOLOGY INC137 citations99
US7573136B2Aug 11, 2009
Semiconductor device assemblies and packages including multiple semiconductor device components
MICRON TECHNOLOGY INC128 citations98
US7109572B2Sep 19, 2006
Quad flat no lead (QFN) grid array package
MICRON TECHNOLOGY INC78 citations98
US6943450B2Sep 13, 2005
Packaged microelectronic devices and methods of forming same
MICRON TECHNOLOGY INC93 citations98
US6746894B2Jun 8, 2004
Ball grid array interposer, packages and methods
MICRON TECHNOLOGY INC249 citations97
US7075816B2Jul 11, 2006
Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same
MICRON TECHNOLOGY INC55 citations96
US6650013B2Nov 18, 2003
Method of manufacturing wire bonded microelectronic device assemblies
MICRON TECHNOLOGY INC107 citations96
US7279780B2Oct 9, 2007
Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same
MICRON TECHNOLOGY INC12 citations92
US7259451B2Aug 21, 2007
Invertible microfeature device packages
MICRON TECHNOLOGY INC28 citations92
US6870247B2Mar 22, 2005
Interposer with a lateral recess in a slot to facilitate connection of intermediate conductive elements to bond pads of a semiconductor die with which the interposer is assembled
MICRON TECHNOLOGY INC12 citations92
US6773960B2Aug 10, 2004
Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate
MICRON TECHNOLOGY INC21 citations92
US6864166B1Mar 8, 2005
Method of manufacturing wire bonded microelectronic device assemblies
MICRON TECHNOLOGY INC51 citations91
US6825572B2Nov 30, 2004
Die package
MICRON TECHNOLOGY INC21 citations91
US7368810B2May 6, 2008
Invertible microfeature device packages
MICRON TECHNOLOGY INC10 citations84
US7274095B2Sep 25, 2007
Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers
MICRON TECHNOLOGY INC12 citations82
US7977157B2Jul 12, 2011
Methods of forming integrated circuit packages, and methods of assembling integrated circuit packages
MICRON TECHNOLOGY INC4 citations74
US6951777B2Oct 4, 2005
Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate
MICRON TECHNOLOGY INC7 citations74
US7528007B2May 5, 2009
Methods for assembling semiconductor devices and interposers
MICRON TECHNOLOGY INC5 citations71
US8709866B2Apr 29, 2014
Methods of forming integrated circuit packages
MICRON TECHNOLOGY INC1 citations63
US7700406B2Apr 20, 2010
Methods of assembling integrated circuit packages
MICRON TECHNOLOGY INC3 citations63
US7112876B2Sep 26, 2006
Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers
MICRON TECHNOLOGY INC3 citations63