Inventor
FRECHETTE RAYMOND A
US16 patents
⚠️ This page may combine multiple inventors who share the name “FRECHETTE RAYMOND A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
15 patentsUS5633528AMay 27, 1997
Lead frame structure for IC devices with strengthened encapsulation adhesion
TEXAS INSTRUMENTS INC207 citations99
US6365974B1Apr 2, 2002
Flex circuit substrate for an integrated circuit package
TEXAS INSTRUMENTS INC73 citations95
US5891377AApr 6, 1999
Dambarless leadframe for molded component encapsulation
TEXAS INSTRUMENTS INC49 citations95
US5429992AJul 4, 1995
Lead frame structure for IC devices with strengthened encapsulation adhesion
TEXAS INSTRUMENTS INC37 citations92
US5302553AApr 12, 1994
Method of forming a coated plastic package
TEXAS INSTRUMENTS INC22 citations92
US5949132ASep 7, 1999
Dambarless leadframe for molded component encapsulation
TEXAS INSTRUMENTS INC28 citations91
US5264376ANov 23, 1993
Method of making a thin film solar cell
TEXAS INSTRUMENTS INC27 citations88
US4868635ASep 19, 1989
Lead frame for integrated circuit
TEXAS INSTRUMENTS INC50 citations87
US5610437AMar 11, 1997
Lead frame for integrated circuits
TEXAS INSTRUMENTS INC13 citations73
US5904503AMay 18, 1999
Method of forming flat inner lead tips on lead frame
TEXAS INSTRUMENTS INC6 citations70
US6302673B1Oct 16, 2001
Integrated circuit chip mold seal
TEXAS INSTRUMENTS INC10 citations69
US4028064AJun 7, 1977
Beryllium copper plating process
TEXAS INSTRUMENTS INC6 citations60
US5942178AAug 24, 1999
Integrated circuit chip mold seal
TEXAS INSTRUMENTS INC3 citations58
US5672915ASep 30, 1997
Ceramic coated plastic package
TEXAS INSTRUMENTS INC1 citations52
US6302672B1Oct 16, 2001
Integrated circuit chip mold seal
TEXAS INSTRUMENTS INC0 citations48