Inventor · disambiguated record
James Jeong
Also filed as: JEONG JAMES · JEONG JAMES Y
8 granted patents·5 pending applications·23 citations·filing 2003–2021
79Inventor score
Top patents by PatentIndex Score
13 records- 0187US9716066B2Interconnect structure comprising fine pitch backside metal redistribution lines combined with viasINTEL CORP·Filed 2013·Granted Jul 25, 2017·16 cites·16 claims
- 0275US9748180B2Through-body via liner depositionINTEL CORP·Filed 2014·Granted Aug 29, 2017·5 cites·25 claims
- 0364US7977248B2Double patterning with single hard maskINTEL CORP·Filed 2007·Granted Jul 12, 2011·2 cites·20 claims
- 0459US11652045B2Via contact patterning method to increase edge placement error marginINTEL CORP·Filed 2021·Granted May 16, 2023·0 cites·20 claims
- 0552US11211324B2Via contact patterning method to increase edge placement error marginINTEL CORP·Filed 2019·Granted Dec 28, 2021·0 cites·20 claims
- 0649US12051623B2Enhanced grating aligned patterning for EUV direct print processesINTEL CORP·Filed 2020·Granted Jul 30, 2024·0 cites·20 claims
- 0746US12368095B2Simultaneous filling of variable aspect ratio single damascene contact to gate and trench vias with low resistance barrierless selective metallizationINTEL CORP·Filed 2021·Granted Jul 22, 2025·0 cites·16 claims
- 0846US2006057852A1Process for low k dielectric plasma etching with high selectivity to deep uv photoresistFU QIANG·Filed 2005·Application pending·0 cites
- 0946US2023143021A1Integrated circuit interconnect structures including copper-free viasINTEL CORP·Filed 2021·Application pending·0 cites
- 1041US7112534B2Process for low k dielectric plasma etching with high selectivity to deep uv photoresistINTEL CORP·Filed 2003·Granted Sep 26, 2006·0 cites·12 claims
- 1141US2009124084A1Fabrication of sub-resolution features for an integrated circuitTAN ELLIOT·Filed 2007·Application pending·0 cites
- 1241US2021183761A1Line patterning in integrated circuit devicesINTEL CORP·Filed 2019·Application pending·0 cites
- 1337US2006000796A1Method for controlling critical dimensions and etch biasTAN ELLIOT·Filed 2004·Application pending·0 cites
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