Inventor
HSU HSIEN-WEN
TW19 patents
⚠️ This page may combine multiple inventors who share the name “HSU HSIEN-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MACRONIX INT CO LTD
6 patentsUS7149121B2Dec 12, 2006
Method and apparatus for changing operating conditions of nonvolatile memory
MACRONIX INT CO LTD22 citations92
US6580287B2Jun 17, 2003
Voltage-boosting generator for reducing effects due to operating voltage variation and temperature change
MACRONIX INT CO LTD18 citations84
US7411833B2Aug 12, 2008
Nitride trapping memory device and method for reading the same
MACRONIX INT CO LTD9 citations82
US7710784B2May 4, 2010
Method of reading the bits of nitride read-only memory cell
MACRONIX INT CO LTD4 citations61
US7262999B2Aug 28, 2007
System and method for preventing read margin degradation for a memory array
MACRONIX INT CO LTD2 citations61
US7310261B2Dec 18, 2007
Nitride read-only memory (NROM) device and method for reading the same
MACRONIX INT CO LTD0 citations50
POWERTECH TECHNOLOGY INC
5 patentsUS11024603B2Jun 1, 2021
Manufacturing method and a related stackable chip package
POWERTECH TECHNOLOGY INC2 citations71
US10224254B2Mar 5, 2019
Package process method including disposing a die within a recess of a one-piece material
POWERTECH TECHNOLOGY INC6 citations71
US10892250B2Jan 12, 2021
Stacked package structure with encapsulation and redistribution layer and fabricating method thereof
POWERTECH TECHNOLOGY INC1 citations61
US10354978B1Jul 16, 2019
Stacked package including exterior conductive element and a manufacturing method of the same
POWERTECH TECHNOLOGY INC1 citations60
US9659884B2May 23, 2017
Carrier substrate
POWERTECH TECHNOLOGY INC0 citations38
ADVANCED CHIP ENG TECH INC
3 patentsUS7525185B2Apr 28, 2009
Semiconductor device package having multi-chips with side-by-side configuration and method of the same
ADVANCED CHIP ENG TECH INC14 citations83
US7335870B1Feb 26, 2008
Method for image sensor protection
ADVANCED CHIP ENG TECH INC11 citations83
US7687923B2Mar 30, 2010
Semiconductor device package having a back side protective scheme
ADVANCED CHIP ENG TECH INC4 citations62