P

Inventor

SHINOZUKA SHINICHI

JP16 patents
⚠️ This page may combine multiple inventors who share the name “SHINOZUKA SHINICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TOKYO ELECTRON LTD

12 patents
US7968825B2Jun 28, 2011

Temperature setting method of thermal processing plate, computer-readable recording medium recording program thereon, and temperature setting apparatus for thermal processing plate

TOKYO ELECTRON LTD29 citations91
US11348791B2May 31, 2022

Bonding apparatus and bonding method

TOKYO ELECTRON LTD3 citations71
US8041525B2Oct 18, 2011

Substrate measuring method, computer-readable recording medium recording program thereon, and substrate measuring system

TOKYO ELECTRON LTD2 citations62
US7985516B2Jul 26, 2011

Substrate processing method, computer-readable storage medium and substrate processing system

TOKYO ELECTRON LTD2 citations62
US7957828B2Jun 7, 2011

Temperature setting method for thermal processing plate, temperature setting apparatus for thermal processing plate, and computer-readable storage medium

TOKYO ELECTRON LTD6 citations62
US7822574B2Oct 26, 2010

Substrate measuring method, computer-readable recording medium recording program thereon, and substrate processing system

TOKYO ELECTRON LTD2 citations62
US7529595B2May 5, 2009

Method of controlling substrate processing apparatus and substrate processing apparatus

TOKYO ELECTRON LTD4 citations62
US7411669B2Aug 12, 2008

Substrate defect inspection method, computer readable storage medium, and defect inspection apparatus

TOKYO ELECTRON LTD5 citations62
US12381083B2Aug 5, 2025

Bonding apparatus and bonding method

TOKYO ELECTRON LTD0 citations61
US7897896B2Mar 1, 2011

Temperature setting method of thermal processing plate, computer-readable recording medium recording program thereon, and temperature setting apparatus for thermal processing plate

TOKYO ELECTRON LTD2 citations61
US12451374B2Oct 21, 2025

Bonding system and inspection method of inspecting combined substrate

TOKYO ELECTRON LTD0 citations55
US7867674B2Jan 11, 2011

Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program

TOKYO ELECTRON LTD0 citations41

TADOKORO MASAHIDE

2 patents

OGATA KUNIE

1 patent

JYOUSAKA MEGUMI

1 patent