Inventor
TAI CHEW THENG
MY3 patents
Patents
3 patentsUS9852918B2Dec 26, 2017
Embedding additive particles in encapsulant of electronic device
INFINEON TECHNOLOGIES AG2 citations66
US9817079B2Nov 14, 2017
Molded sensor package with an integrated magnet and method of manufacturing molded sensor packages with an integrated magnet
INFINEON TECHNOLOGIES AG0 citations39
US9540539B2Jan 10, 2017
Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device
INFINEON TECHNOLOGIES AG0 citations34