Inventor
CHANG MOOI LING
MY11 patents
⚠️ This page may combine multiple inventors who share the name “CHANG MOOI LING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
10 patentsUS10515912B2Dec 24, 2019
Integrated circuit packages
INTEL CORP37 citations90
US11121074B2Sep 14, 2021
Packaged die stacks with stacked capacitors and methods of assembling same
INTEL CORP3 citations71
US10998261B2May 4, 2021
Over-molded IC package with in-mold capacitor
INTEL CORP4 citations71
US10593618B2Mar 17, 2020
Packaged die stacks with stacked capacitors and methods of assembling same
INTEL CORP3 citations71
US12575448B2Mar 10, 2026
Integrated circuit packages with on package memory architectures
INTEL CORP0 citations61
US12349276B2Jul 1, 2025
Co-planar interconnection mechanisms for circuit boards
INTEL CORP0 citations61
US11696409B2Jul 4, 2023
Vertical embedded component in a printed circuit board blind hole
INTEL CORP0 citations61
US10541200B2Jan 21, 2020
Over-molded IC packages with embedded voltage reference plane and heater spreader
INTEL CORP1 citations61
US11096284B2Aug 17, 2021
Compact semiconductor chip system and method
INTEL CORP0 citations55
US10297541B2May 21, 2019
Multiple-component substrate for a microelectronic device
INTEL CORP0 citations48